In multi-layer PCBs, the failure mode most associated with delamination is:

In multi-layer PCBs, the failure mode most associated with delamination is:

• A. Age
• B. Corrosion
• C. Interlayer separation
• D. Overheating

Answer: (C)

Delamination is the physical separation between the bonded layers in a multi-layer PCB. The failure mode most closely associated with this is interlayer separation, where the adhesive or resin that binds the copper and dielectric layers fails and the layers begin to pull apart. This separation disrupts the conductive paths and can expose copper, leading to opens or shorts. Moisture ingress, thermal cycling, improper bonding during fabrication, and mechanical stress can all drive interlayer separation by weakening the lamination between layers. Age and overheating can accelerate these processes, but the defining issue for delamination is the actual separation between the layers rather than aging alone, corrosion, or heat exposure in isolation.

Delamination is the physical separation between the bonded layers in a multi-layer PCB. The failure mode most closely associated with this is interlayer separation, where the adhesive or resin that binds the copper and dielectric layers fails and the layers begin to pull apart. This separation disrupts the conductive paths and can expose copper, leading to opens or shorts.

Moisture ingress, thermal cycling, improper bonding during fabrication, and mechanical stress can all drive interlayer separation by weakening the lamination between layers. Age and overheating can accelerate these processes, but the defining issue for delamination is the actual separation between the layers rather than aging alone, corrosion, or heat exposure in isolation.